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• W1839983603 abstract "Thermoset-based adhesives are used as thermal and electrical interfaces. In automotive applications, they are required to have excellent adhesion since delamination may precipitate other electrical, thermal or mechanical failure mechanisms. A vast amount of literature is available on the investigation of molding compounds and various material interfaces. However, only very few studies focus on delamination of adhesive interfaces. The reason is that apparently it was not possible to initiate an interface crack in a delamination sample. In various attempts, random cracking in the adhesive was obtained instead. Yet interface cracks are found in real products and really form a reliability issue. But so far the absence of adequate interface strength data makes it hardly possible to design for reliability of products with adhesive interfaces." @default.
• W1839983603 created "2016-06-24" @default.
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• W1839983603 date "2015-04-01" @default.
• W1839983603 modified "2023-09-27" @default.
• W1839983603 title "Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications" @default.
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• W1839983603 doi "https://doi.org/10.1109/eurosime.2015.7103078" @default.
• W1839983603 hasPublicationYear "2015" @default.
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