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• W2092111048 abstract "The increasing demand for fine pitch flip-chip interconnection has led to significant interest in alternatives to the widely used solder joints. The use of mono-sized metal coated polymer based micro-spheres is emerging as a method to achieve more robust and reliable interconnects for ball grid arrays and chip scale packages. This paper presents results from a collaborative research project investigating whether polymer cored interconnects are a viable replacement for such ultra-fine pitch solder joints. The focus of this work centres on the selective deposition of these polymer microspheres onto fine pitch bond pads. An important advantage of using such microspheres is that their mechanical properties can be tailored to suit the needs of the application, in addition to the relatively low usage of metals. Initial trials have been carried out using 9.8 μm diameter polymer particles which have been coated with electroless nickel and then an immersion gold surface layer. In order to selectively deposit these particles on to the bond pads of an ASIC device they were required to be charged. The particles were immersed in an aqueous acid solution and after rinsing in deionised water they were then transferred to a suitable solvent. This process resulted in a net positive charge on the particle surface which allowed the particles to be deposited using electrophoretic techniques i.e. an electric field was applied to the particle suspension to drive the particles to deposit on the substrate. The effect of this immersion in the aqueous acid solution on the surface metal layer of the particles has been studied using electron microscopy. The rate of electrophoretic deposition of the particles onto a homogeneous gold coated silicon substrate was studied to determine how the length of chemical treatment affects the particle deposition. Following from this the same technique was then used to deposit the particles directly on to the bond pads of an ASIC device. Using the ASIC as the cathode in the electrophoretic setup the particles were able to be selectively deposited onto bond pads with a pitch of 170 μm." @default.
• W2092111048 created "2016-06-24" @default.
• W2092111048 creator A5016297677 @default.
• W2092111048 creator A5044627082 @default.
• W2092111048 creator A5049403171 @default.
• W2092111048 creator A5060478517 @default.
• W2092111048 creator A5077005623 @default.
• W2092111048 date "2012-05-01" @default.
• W2092111048 modified "2023-09-28" @default.
• W2092111048 title "Metal-coated mono-sized polymer core particles for fine pitch flip-chip interconnects" @default.
• W2092111048 cites W1965911899 @default.
• W2092111048 cites W1974110706 @default.
• W2092111048 cites W1976697629 @default.
• W2092111048 cites W1997279689 @default.
• W2092111048 cites W2007875734 @default.
• W2092111048 cites W2010086753 @default.
• W2092111048 cites W2020198382 @default.
• W2092111048 cites W2021608769 @default.
• W2092111048 cites W2043880039 @default.
• W2092111048 cites W2052261390 @default.
• W2092111048 cites W2053132121 @default.
• W2092111048 cites W2057926504 @default.
• W2092111048 cites W2059603766 @default.
• W2092111048 cites W2067378045 @default.
• W2092111048 cites W2076154812 @default.
• W2092111048 cites W2089448660 @default.
• W2092111048 cites W2112438420 @default.
• W2092111048 cites W2122403347 @default.
• W2092111048 cites W2163559508 @default.
• W2092111048 cites W2180519826 @default.
• W2092111048 cites W4242629389 @default.
• W2092111048 doi "https://doi.org/10.1109/ectc.2012.6248831" @default.
• W2092111048 hasPublicationYear "2012" @default.
• W2092111048 type Work @default.
• W2092111048 sameAs 2092111048 @default.
• W2092111048 citedByCount "6" @default.
• W2092111048 countsByYear W20921110482012 @default.
• W2092111048 countsByYear W20921110482014 @default.
• W2092111048 countsByYear W20921110482015 @default.
• W2092111048 countsByYear W20921110482016 @default.
• W2092111048 crossrefType "proceedings-article" @default.
• W2092111048 hasAuthorship W2092111048A5016297677 @default.
• W2092111048 hasAuthorship W2092111048A5044627082 @default.
• W2092111048 hasAuthorship W2092111048A5049403171 @default.
• W2092111048 hasAuthorship W2092111048A5060478517 @default.
• W2092111048 hasAuthorship W2092111048A5077005623 @default.
• W2092111048 hasConcept C123745756 @default.
• W2092111048 hasConcept C147789679 @default.
• W2092111048 hasConcept C159985019 @default.
• W2092111048 hasConcept C184651966 @default.
• W2092111048 hasConcept C185592680 @default.
• W2092111048 hasConcept C192562407 @default.
• W2092111048 hasConcept C2779227376 @default.
• W2092111048 hasConcept C31258907 @default.
• W2092111048 hasConcept C41008148 @default.
• W2092111048 hasConcept C50296614 @default.
• W2092111048 hasConcept C521977710 @default.
• W2092111048 hasConcept C68928338 @default.
• W2092111048 hasConcept C79072407 @default.
• W2092111048 hasConcept C94709252 @default.
• W2092111048 hasConceptScore W2092111048C123745756 @default.
• W2092111048 hasConceptScore W2092111048C147789679 @default.
• W2092111048 hasConceptScore W2092111048C159985019 @default.
• W2092111048 hasConceptScore W2092111048C184651966 @default.
• W2092111048 hasConceptScore W2092111048C185592680 @default.
• W2092111048 hasConceptScore W2092111048C192562407 @default.
• W2092111048 hasConceptScore W2092111048C2779227376 @default.
• W2092111048 hasConceptScore W2092111048C31258907 @default.
• W2092111048 hasConceptScore W2092111048C41008148 @default.
• W2092111048 hasConceptScore W2092111048C50296614 @default.
• W2092111048 hasConceptScore W2092111048C521977710 @default.
• W2092111048 hasConceptScore W2092111048C68928338 @default.
• W2092111048 hasConceptScore W2092111048C79072407 @default.
• W2092111048 hasConceptScore W2092111048C94709252 @default.
• W2092111048 hasLocation W20921110481 @default.
• W2092111048 hasOpenAccess W2092111048 @default.
• W2092111048 hasPrimaryLocation W20921110481 @default.
• W2092111048 hasRelatedWork W2050959455 @default.
• W2092111048 hasRelatedWork W2071964988 @default.
• W2092111048 hasRelatedWork W2073651368 @default.
• W2092111048 hasRelatedWork W2147755341 @default.
• W2092111048 hasRelatedWork W2153218153 @default.
• W2092111048 hasRelatedWork W2532553300 @default.
• W2092111048 hasRelatedWork W2534068125 @default.
• W2092111048 hasRelatedWork W2539013570 @default.
• W2092111048 hasRelatedWork W195554200 @default.
• W2092111048 hasRelatedWork W2133441394 @default.
• W2092111048 isParatext "false" @default.
• W2092111048 isRetracted "false" @default.
• W2092111048 magId "2092111048" @default.
• W2092111048 workType "article" @default.