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- W2133071073 abstract "This paper discusses the procedure and approximations used when performing thermal analysis of electronic devices inside cell phone handsets. Characterization of the flow from a theoretical perspective is covered first together with the equations to determine the effective convection coefficient. A simulation software is then used to perfom CFD and FEA models to evaluate the validity of different assumptions about the flow. The paper fmishes off with recommendations aimed at reducing the overall complexity of similar analyses without impacting the accuracy. Component and System Level Thermal Simulations The thermal performance of an electronic package is one of the critical parameters that govem the chip's temperature and hence lifetime. The advent of new wafer fabrication technologies has allowed designers to integrate more and more functions onto smaller and smaller chips. Furthermore, the drive to shrink the overall component size coupled with the need for low cost packaging solutions, has made chip scale packages (CSP) with no heat slugs the primary choice for applications such as cell phones. In addition to these factors, the overall enclosure size of the handset itself is constantly decreasing. This combination of smaller die, low cost CSPs and high packing density withim the handset has reduced the margin of error allowed when performing thermal analysis." @default.
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- W2133071073 date "2004-06-22" @default.
- W2133071073 modified "2023-09-25" @default.
- W2133071073 title "Electronic components in cell phone handsets: thermal simulations and evaluation of modeling assumptions" @default.
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- W2133071073 doi "https://doi.org/10.1109/ectc.2003.1216316" @default.
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