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- W2380978737 abstract "Lithography technology for thick film photo-resists is a much more complicated process. The mechanism of exposure for the thick DNQ-Novolak-based photo-resists is discussed in detail, and then the effect of exposure intensity on the photochemical reaction speed is investigated by using kinetic model. Numerical simulation and experiments show that the simulated results are consistent with those from experiments. For the lithography of thick DNQ-Novolak based resists, the photochemical reaction speed is obviously affected by the intensity magnitude during exposure, which will lead to exposure reciprocity failure. The cause originates from increase in temperature of resists, due to the highly exothermic reaction during exposure. These results are useful for the lithographic process optimization of thick film photo-resists." @default.
- W2380978737 created "2016-06-24" @default.
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- W2380978737 date "2006-01-01" @default.
- W2380978737 modified "2023-09-23" @default.
- W2380978737 title "Exposure intensity effect on the photochemical reaction speed in the lithography for thick film photo-resists" @default.
- W2380978737 hasPublicationYear "2006" @default.
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