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• W2034321567 abstract "With the trend of commercialization of through-silicon vias (TSVs) in 3D integrated microsystems, new TSVs filling processes are developed to meet the requirement of low-cost fabricating of high-electrical performance and high-thermal reliability TSVs without any voids. In this paper, Sn-based IMCs are used as the filling materials for the formation of conductive path of TSVs. The Sn-based IMCs filling process is studied and the initial results are reported. Thermal-mechanical stress analysis of TSVs with different filling materials is performed through finite element analysis (FEA). The isotropic and anisotropic elastic property of silicon is considered in the FEA modeling. A static temperature ramp down analysis from 125°C to -40°C was carried out to simulate the maximum thermal stress state. The simulation results indicate that the TSVs filled with Cu6Sn5 and Ni3Sn4 exhibit lower thermal stress compared with solder TSVs and even Cu TSVs." @default.
• W2034321567 created "2016-06-24" @default.
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• W2034321567 date "2012-08-01" @default.
• W2034321567 modified "2023-09-26" @default.
• W2034321567 title "Development and thermo-mechanical stress analysis of TSVs filling with Sn-based intermetallics" @default.
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• W2034321567 doi "https://doi.org/10.1109/icept-hdp.2012.6474563" @default.
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