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• W2527720706 abstract "This paper presents new material data for single- and multi- layer CMOS compatible poly-SiGe films, including mechanical quality factor (Q), Young's modulus, and strain gradient. Using audio frequency folded-flexure comb-drive resonators, the mechanical quality factor of poly-SiGe was determined at 2µTorr pressure. As-deposited poly-SiGe has Q = 20,000 - 31,000. CMOS compatible rapid thermal annealing (RTA) at 525°C for 60 seconds results in a quality factor between 40,000 and 44,000. We have measured the highest Q factor yet reported for poly-SiGe (Qs 61,100), as a result of RTA at 600°C for one minute. The measured resonant frequencies of the resonators were used to back-calculate the Young's modulus of poly-SiGe: E = 155 ± 5GPa. The calculated elastic modulus is significantly higher than the metallurgical Young's modulus of 146GPa. The as-deposited strain gradient of the tri-layer poly-SiGe film was found to be 1.75·10 -4 µm -1 (curl-up). RTA at 600°C for one minute drops the tri-layer strain gradient to 2.67·10 -5 µm -1 (curl-up). The graded Ge content multi-layer film was observed to induce a larger normalized strain gradient." @default.
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• W2527720706 date "2002-06-02" @default.
• W2527720706 modified "2023-10-17" @default.
• W2527720706 title "Poly-SiGe: A High-Q Structural Material for Integrated RF MEMS" @default.
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• W2527720706 doi "https://doi.org/10.31438/trf.hh2002.9" @default.
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