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• W4302773670 endingPage "109759" @default.
• W4302773670 startingPage "109759" @default.
• W4302773670 abstract "Over the past half-century, the increase of on-chip power and on-chip integration density has created new thermal management challenges for 2.5D/3D semiconductor packaging. High-performance thermal management materials in electronic encapsulation are very important to ensure the performance and reliability of the electronic devices. Graphene-based polymer composites have attracted much attention due to the ultrahigh thermal conductivity and large surface area of graphene. However, graphene nanosheets easily aggregate and lack functional groups on their surfaces, leading to phonon scattering within the interfaces. In this work, silver nanoparticles are in-situ formed on the graphene surface by a facile method, then the graphene-silver nanofillers are modified by (3-Mercaptopropyl)trimethoxysilane (MPTS). MPTS reacts with silver nanoparticles to connect them with epoxy. Also, silver nanoparticles on the surface of graphene can fuse together to form metallurgical joints that connect graphene nanosheets. With the fundamental understanding of sintering mechanisms and reducing two types of thermal interfacial resistances (filler-filler and filler-epoxy interface resistances) simultaneously, the resultant epoxy nanocomposites achieve a high through-plane thermal conductivity of 0.99 W/mK at 8 wt% loading. This corresponds to a 465.7% increase in thermal conductivity as compared to that of neat epoxy. Also, the nanocomposites present a low CTE and high thermal stability. They show strong cooling capability and heat dissipation as thermal interface materials (TIMs) through both experimentation and simulation, providing a promising new insight into thermal management materials to meet the demands of next generation high-power and high-density semiconductor packaging." @default.
• W4302773670 created "2022-10-07" @default.
• W4302773670 creator A5013638658 @default.
• W4302773670 creator A5022217840 @default.
• W4302773670 creator A5026097036 @default.
• W4302773670 creator A5042734294 @default.
• W4302773670 creator A5044579358 @default.
• W4302773670 creator A5063220018 @default.
• W4302773670 creator A5072930677 @default.
• W4302773670 creator A5076694458 @default.
• W4302773670 creator A5079635303 @default.
• W4302773670 creator A5089388667 @default.
• W4302773670 date "2022-11-01" @default.
• W4302773670 modified "2023-09-25" @default.
• W4302773670 title "A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device packaging" @default.
• W4302773670 cites W149666797 @default.
• W4302773670 cites W1504787922 @default.
• W4302773670 cites W1992701177 @default.
• W4302773670 cites W1997014239 @default.
• W4302773670 cites W1997231630 @default.
• W4302773670 cites W2001546513 @default.
• W4302773670 cites W2011688819 @default.
• W4302773670 cites W2015673981 @default.
• W4302773670 cites W2025055091 @default.
• W4302773670 cites W2033515476 @default.
• W4302773670 cites W2036343586 @default.
• W4302773670 cites W2040786093 @default.
• W4302773670 cites W2052872572 @default.
• W4302773670 cites W2061534310 @default.
• W4302773670 cites W2090633911 @default.
• W4302773670 cites W2103157103 @default.
• W4302773670 cites W2118286293 @default.
• W4302773670 cites W2166691312 @default.
• W4302773670 cites W2238505698 @default.
• W4302773670 cites W2310230662 @default.
• W4302773670 cites W2314049344 @default.
• W4302773670 cites W2805635108 @default.
• W4302773670 cites W2886410468 @default.
• W4302773670 cites W2920971975 @default.
• W4302773670 cites W2953463921 @default.
• W4302773670 cites W2969901941 @default.
• W4302773670 cites W2980958022 @default.
• W4302773670 cites W3023452366 @default.
• W4302773670 cites W3043667050 @default.
• W4302773670 cites W3093262745 @default.
• W4302773670 cites W3110582236 @default.
• W4302773670 cites W3127688682 @default.
• W4302773670 cites W3159465837 @default.
• W4302773670 cites W3186323237 @default.
• W4302773670 cites W4212952101 @default.
• W4302773670 cites W4220904024 @default.
• W4302773670 doi "https://doi.org/10.1016/j.compscitech.2022.109759" @default.
• W4302773670 hasPublicationYear "2022" @default.
• W4302773670 type Work @default.
• W4302773670 citedByCount "0" @default.
• W4302773670 crossrefType "journal-article" @default.
• W4302773670 hasAuthorship W4302773670A5013638658 @default.
• W4302773670 hasAuthorship W4302773670A5022217840 @default.
• W4302773670 hasAuthorship W4302773670A5026097036 @default.
• W4302773670 hasAuthorship W4302773670A5042734294 @default.
• W4302773670 hasAuthorship W4302773670A5044579358 @default.
• W4302773670 hasAuthorship W4302773670A5063220018 @default.
• W4302773670 hasAuthorship W4302773670A5072930677 @default.
• W4302773670 hasAuthorship W4302773670A5076694458 @default.
• W4302773670 hasAuthorship W4302773670A5079635303 @default.
• W4302773670 hasAuthorship W4302773670A5089388667 @default.
• W4302773670 hasConcept C108225325 @default.
• W4302773670 hasConcept C159985019 @default.
• W4302773670 hasConcept C166595027 @default.
• W4302773670 hasConcept C171250308 @default.
• W4302773670 hasConcept C192562407 @default.
• W4302773670 hasConcept C200657195 @default.
• W4302773670 hasConcept C2778024649 @default.
• W4302773670 hasConcept C30080830 @default.
• W4302773670 hasConcept C3231350 @default.
• W4302773670 hasConcept C49040817 @default.
• W4302773670 hasConcept C521977710 @default.
• W4302773670 hasConcept C92880739 @default.
• W4302773670 hasConcept C97346530 @default.
• W4302773670 hasConceptScore W4302773670C108225325 @default.
• W4302773670 hasConceptScore W4302773670C159985019 @default.
• W4302773670 hasConceptScore W4302773670C166595027 @default.
• W4302773670 hasConceptScore W4302773670C171250308 @default.
• W4302773670 hasConceptScore W4302773670C192562407 @default.
• W4302773670 hasConceptScore W4302773670C200657195 @default.
• W4302773670 hasConceptScore W4302773670C2778024649 @default.
• W4302773670 hasConceptScore W4302773670C30080830 @default.
• W4302773670 hasConceptScore W4302773670C3231350 @default.
• W4302773670 hasConceptScore W4302773670C49040817 @default.
• W4302773670 hasConceptScore W4302773670C521977710 @default.
• W4302773670 hasConceptScore W4302773670C92880739 @default.
• W4302773670 hasConceptScore W4302773670C97346530 @default.
• W4302773670 hasLocation W43027736701 @default.
• W4302773670 hasOpenAccess W4302773670 @default.
• W4302773670 hasPrimaryLocation W43027736701 @default.
• W4302773670 hasRelatedWork W1558007503 @default.
• W4302773670 hasRelatedWork W1995958177 @default.
• W4302773670 hasRelatedWork W2020946050 @default.

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