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- W4313442675 abstract "In the present study, a novel multicomponent accumulative roll bonding (MARB) approach was proposed and successfully applied to prepare a nanostructured Ag/Cu multilayered composite. Microstructure, hardness and conductivity of Ag/Cu multilayered composites with different MARB cycles were investigated by electron backscatter diffraction, transmission electron microscopy, nanoindentation and four-point probe direct current methods. It is demonstrated that the MARB approach is able to effectively suppress the shear band formation and result in a remarkable reduction in the thickness of the Ag/Cu multilayered composite down to 40 nm via only 6 cycles. The as-prepared nanostructured Ag/Cu multilayered composite exhibits an excellent combination of high hardness (2.24 GPa) and high electrical conductivity (equivalent to 84% of international annealed copper standard; IACS). It owes these extraordinary properties to the atomically ordered and chemically sharp heterophase interfaces and low density of grain boundaries resulting from the MARB process." @default.
- W4313442675 created "2023-01-06" @default.
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- W4313442675 date "2023-02-01" @default.
- W4313442675 modified "2023-10-07" @default.
- W4313442675 title "A nanostructured Ag/Cu multilayered composite exhibiting high hardness and high electrical conductivity prepared by a novel multicomponent accumulative roll bonding" @default.
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- W4313442675 doi "https://doi.org/10.1016/j.matchar.2022.112613" @default.
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