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• W2897788767 date "2018-10-10" @default.
• W2897788767 modified "2023-09-24" @default.
• W2897788767 title "Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED" @default.
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• W2897788767 doi "https://doi.org/10.1007/s11664-018-6727-2" @default.
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