Matches in Wikidata for { <http://www.wikidata.org/entity/Q57031342> ?p ?o ?g. }
Showing items 1 to 38 of
38
with 100 items per page.
- Q57031342 description "article scientifique publié en 2013" @default.
- Q57031342 description "im April 2013 veröffentlichter wissenschaftlicher Artikel" @default.
- Q57031342 description "wetenschappelijk artikel" @default.
- Q57031342 description "наукова стаття, опублікована у квітні 2013" @default.
- Q57031342 name "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules" @default.
- Q57031342 name "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules" @default.
- Q57031342 type Item @default.
- Q57031342 label "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules" @default.
- Q57031342 label "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules" @default.
- Q57031342 prefLabel "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules" @default.
- Q57031342 prefLabel "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules" @default.
- Q57031342 P1433 Q57031342-FF00FC87-E231-4430-930E-C8927B62DD00 @default.
- Q57031342 P1476 Q57031342-ED4A8E6D-460E-4F85-AD35-47258C3E1397 @default.
- Q57031342 P2093 Q57031342-01089CBE-A640-4345-8EE2-968392DFCB4A @default.
- Q57031342 P2093 Q57031342-146C0A80-1857-477C-929D-48BA950F53FA @default.
- Q57031342 P2093 Q57031342-15CAB80A-C1BA-4135-B446-7647424C1147 @default.
- Q57031342 P2093 Q57031342-2D7A64F7-C492-4B7E-BD69-381AA9496464 @default.
- Q57031342 P2093 Q57031342-BE61D4E4-07C2-40FC-AE34-766FCFFEB6A6 @default.
- Q57031342 P304 Q57031342-C6193CD9-CDE8-4AD4-8D5A-2C9A1AE14D19 @default.
- Q57031342 P31 Q57031342-AFD7D46A-7EDA-4C4E-961C-EEC76F228584 @default.
- Q57031342 P356 Q57031342-B3751DB7-C749-4261-A2BE-B0F6A8FCCB7E @default.
- Q57031342 P433 Q57031342-66D9540C-0B44-4480-AD4C-A56770C8CA24 @default.
- Q57031342 P478 Q57031342-8A99CA01-E6E2-4444-B319-A5572520D6F2 @default.
- Q57031342 P577 Q57031342-D6281616-7F64-4ADC-8E2F-2539124D87D5 @default.
- Q57031342 P356 J.SCRIPTAMAT.2012.12.017 @default.
- Q57031342 P1433 Q15763353 @default.
- Q57031342 P1476 "Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules" @default.
- Q57031342 P2093 "Honglai Zhu" @default.
- Q57031342 P2093 "Jinquan Xu" @default.
- Q57031342 P2093 "Masami Fujiwara" @default.
- Q57031342 P2093 "Ming Dao" @default.
- Q57031342 P2093 "Yuming Zhang" @default.
- Q57031342 P304 "607-610" @default.
- Q57031342 P31 Q13442814 @default.
- Q57031342 P356 "10.1016/J.SCRIPTAMAT.2012.12.017" @default.
- Q57031342 P433 "8" @default.
- Q57031342 P478 "68" @default.
- Q57031342 P577 "2013-04-01T00:00:00Z" @default.