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- Q57397562 description "wetenschappelijk artikel" @default.
- Q57397562 description "наукова стаття, опублікована в травні 2014" @default.
- Q57397562 name "Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias" @default.
- Q57397562 name "Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias" @default.
- Q57397562 type Item @default.
- Q57397562 label "Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias" @default.
- Q57397562 label "Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias" @default.
- Q57397562 prefLabel "Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias" @default.
- Q57397562 prefLabel "Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias" @default.
- Q57397562 P1433 Q57397562-978334B1-F2AC-440E-BE44-E9794D9A499B @default.
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- Q57397562 P2093 Q57397562-CC62D9EC-76B3-4A35-B4A4-E2443406B9F1 @default.
- Q57397562 P2093 Q57397562-DCF968B8-BC84-4AF3-B82B-9CBD24114A96 @default.
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- Q57397562 P304 Q57397562-6663AE1E-926E-4FF6-83B2-BE2329B7528A @default.
- Q57397562 P31 Q57397562-0271E1DB-D70D-4526-92F9-A34D195AA665 @default.
- Q57397562 P356 Q57397562-133C421A-5BA1-4086-AFC9-22CA304B9F53 @default.
- Q57397562 P478 Q57397562-CC8F15FE-4ADE-45E0-8B43-CC4EF0ECE596 @default.
- Q57397562 P50 Q57397562-BF612905-748D-4FCA-950F-290FB9A3F813 @default.
- Q57397562 P50 Q57397562-CAC47D4F-D19E-48EF-BDF7-26B9FA915570 @default.
- Q57397562 P577 Q57397562-A2B75486-9BCF-4EF7-A857-28B76A863C9F @default.
- Q57397562 P921 Q57397562-E0E80F5E-58ED-4F2D-BE95-663B753F1427 @default.
- Q57397562 P356 J.MEE.2013.11.010 @default.
- Q57397562 P1433 Q2615776 @default.
- Q57397562 P1476 "Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias" @default.
- Q57397562 P2093 "Andrew Price" @default.
- Q57397562 P2093 "Christopher Jones" @default.
- Q57397562 P2093 "Larissa Djomeni" @default.
- Q57397562 P2093 "Sabrina Fadloun" @default.
- Q57397562 P2093 "Steve Burgess" @default.
- Q57397562 P2093 "Stéphane Minoret" @default.
- Q57397562 P2093 "Sylvain Maitrejean" @default.
- Q57397562 P2093 "Thierry Mourier" @default.
- Q57397562 P2093 "Yun Zhou" @default.
- Q57397562 P304 "127-132" @default.
- Q57397562 P31 Q13442814 @default.
- Q57397562 P356 "10.1016/J.MEE.2013.11.010" @default.
- Q57397562 P478 "120" @default.
- Q57397562 P50 Q57385729 @default.
- Q57397562 P50 Q57397585 @default.
- Q57397562 P577 "2014-05-01T00:00:00Z" @default.
- Q57397562 P921 Q214781 @default.