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- Q58368981 description "article scientifique publié en 2006" @default.
- Q58368981 description "wetenschappelijk artikel" @default.
- Q58368981 description "наукова стаття, опублікована в липні 2006" @default.
- Q58368981 name "Test structure assembly for bump bond yield measurement on high density flip chip technologies" @default.
- Q58368981 name "Test structure assembly for bump bond yield measurement on high density flip chip technologies" @default.
- Q58368981 type Item @default.
- Q58368981 label "Test structure assembly for bump bond yield measurement on high density flip chip technologies" @default.
- Q58368981 label "Test structure assembly for bump bond yield measurement on high density flip chip technologies" @default.
- Q58368981 prefLabel "Test structure assembly for bump bond yield measurement on high density flip chip technologies" @default.
- Q58368981 prefLabel "Test structure assembly for bump bond yield measurement on high density flip chip technologies" @default.
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- Q58368981 P8978 Q58368981-A767A77A-8605-46A1-89A1-DFB8A496720C @default.
- Q58368981 P356 J.MICROREL.2005.10.001 @default.
- Q58368981 P8978 UllanLCBCGMMPP06 @default.
- Q58368981 P1433 Q13852898 @default.
- Q58368981 P1476 "Test structure assembly for bump bond yield measurement on high density flip chip technologies" @default.
- Q58368981 P2093 "J. García" @default.
- Q58368981 P2093 "M. Maiorino" @default.
- Q58368981 P2093 "M. Ullán" @default.
- Q58368981 P2093 "R. Martínez" @default.
- Q58368981 P304 "1095-1100" @default.
- Q58368981 P31 Q13442814 @default.
- Q58368981 P356 "10.1016/J.MICROREL.2005.10.001" @default.
- Q58368981 P433 "7" @default.
- Q58368981 P478 "46" @default.
- Q58368981 P50 Q113554349 @default.
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- Q58368981 P577 "2006-07-01T00:00:00Z" @default.
- Q58368981 P8978 "journals/mr/UllanLCBCGMMPP06" @default.