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- Q59142627 description "im Jahr 2017 veröffentlichter wissenschaftlicher Artikel" @default.
- Q59142627 description "wetenschappelijk artikel" @default.
- Q59142627 description "наукова стаття, опублікована у 2017" @default.
- Q59142627 name "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses" @default.
- Q59142627 name "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses" @default.
- Q59142627 type Item @default.
- Q59142627 label "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses" @default.
- Q59142627 label "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses" @default.
- Q59142627 prefLabel "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses" @default.
- Q59142627 prefLabel "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses" @default.
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- Q59142627 P275 Q59142627-DF53CF57-7E38-4465-A49E-5F6904FFF4CD @default.
- Q59142627 P304 Q59142627-1D42AB4F-F96E-4777-854E-B23C232FE976 @default.
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- Q59142627 P478 Q59142627-82141A95-4143-4790-84F8-BC29D9676633 @default.
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- Q59142627 P6216 Q59142627-8AEBFAE4-9130-4177-B738-F5D629BE583C @default.
- Q59142627 P356 4903924 @default.
- Q59142627 P1433 Q15756324 @default.
- Q59142627 P1476 "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses" @default.
- Q59142627 P2093 "Dian Wang" @default.
- Q59142627 P2093 "Lijie Sun" @default.
- Q59142627 P2093 "Xianghu Guo" @default.
- Q59142627 P2093 "Xun Qiu" @default.
- Q59142627 P2093 "Yuanying Qiu" @default.
- Q59142627 P275 Q20007257 @default.
- Q59142627 P304 "1-8" @default.
- Q59142627 P31 Q13442814 @default.
- Q59142627 P356 "10.1155/2017/4903924" @default.
- Q59142627 P478 "2017" @default.
- Q59142627 P577 "2017-01-01T00:00:00Z" @default.
- Q59142627 P6216 Q50423863 @default.