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- Q60151890 description "article scientifique publié en 2013" @default.
- Q60151890 description "scholarly article by Dong Tian et al published August 2013 in Surface & Coatings Technology" @default.
- Q60151890 description "wetenschappelijk artikel" @default.
- Q60151890 description "наукова стаття, опублікована в серпні 2013" @default.
- Q60151890 name "A Pd-free activation method for electroless nickel deposition on copper" @default.
- Q60151890 name "A Pd-free activation method for electroless nickel deposition on copper" @default.
- Q60151890 type Item @default.
- Q60151890 label "A Pd-free activation method for electroless nickel deposition on copper" @default.
- Q60151890 label "A Pd-free activation method for electroless nickel deposition on copper" @default.
- Q60151890 prefLabel "A Pd-free activation method for electroless nickel deposition on copper" @default.
- Q60151890 prefLabel "A Pd-free activation method for electroless nickel deposition on copper" @default.
- Q60151890 P1433 Q60151890-2909B89D-8394-452F-A97E-7CD6FA955F6D @default.
- Q60151890 P1476 Q60151890-4DCEA14C-FCCA-4421-AB12-E9A0D00265C8 @default.
- Q60151890 P2093 Q60151890-03B5B4BB-F24F-48EF-8ECF-450717D44A92 @default.
- Q60151890 P2093 Q60151890-19E1531D-E941-45ED-9E49-68B6CD7037A7 @default.
- Q60151890 P2093 Q60151890-3002C8EB-D186-405E-BF48-C90DA6390F84 @default.
- Q60151890 P2093 Q60151890-3F797122-1C91-4B05-8AD0-CE754D016CE1 @default.
- Q60151890 P2093 Q60151890-50CBFA87-B71F-4CBA-9B03-F7BFD8DFEB42 @default.
- Q60151890 P2093 Q60151890-7D64130A-EE14-41EC-9116-F6E8B59B11DF @default.
- Q60151890 P2093 Q60151890-A6BC96A0-EBF6-42E5-83C9-5FABFAC7CD82 @default.
- Q60151890 P304 Q60151890-A795191A-310F-4191-8B22-1CDF5146DF34 @default.
- Q60151890 P31 Q60151890-D0255E90-B9E3-4332-8A4B-FE0D0EFBED32 @default.
- Q60151890 P356 Q60151890-DD6D2DFF-2383-451E-B1FF-3B8E245BAED6 @default.
- Q60151890 P478 Q60151890-A00E86D8-13C4-47EF-BE7A-8F787D51026A @default.
- Q60151890 P50 Q60151890-95A64A2E-E345-45B5-A9CB-1EB9473C6195 @default.
- Q60151890 P50 Q60151890-9E155BED-3BB5-4D96-8B06-8084F7798526 @default.
- Q60151890 P577 Q60151890-8AC6BE07-9381-48BA-AE7C-A54339AEC7C5 @default.
- Q60151890 P921 Q60151890-18390DB2-EE1D-4058-9AF7-BCD620489896 @default.
- Q60151890 P921 Q60151890-99ef7d05-28e8-4711-96fb-89cb7141f3ff @default.
- Q60151890 P356 J.SURFCOAT.2013.03.048 @default.
- Q60151890 P1433 Q14421652 @default.
- Q60151890 P1476 "A Pd-free activation method for electroless nickel deposition on copper" @default.
- Q60151890 P2093 "De Y. Li" @default.
- Q60151890 P2093 "Dong Tian" @default.
- Q60151890 P2093 "Fang F. Wang" @default.
- Q60151890 P2093 "Ning Li" @default.
- Q60151890 P2093 "Ning Xiao" @default.
- Q60151890 P2093 "Rui Q. Liu" @default.
- Q60151890 P2093 "Wei Gao" @default.
- Q60151890 P304 "27-33" @default.
- Q60151890 P31 Q13442814 @default.
- Q60151890 P356 "10.1016/J.SURFCOAT.2013.03.048" @default.
- Q60151890 P478 "228" @default.
- Q60151890 P50 Q42456712 @default.
- Q60151890 P50 Q47503190 @default.
- Q60151890 P577 "2013-08-01T00:00:00Z" @default.
- Q60151890 P921 Q214781 @default.
- Q60151890 P921 Q744 @default.