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- Q60154794 description "article scientifique publié en 2005" @default.
- Q60154794 description "artículu científicu" @default.
- Q60154794 description "im September 2005 veröffentlichter wissenschaftlicher Artikel" @default.
- Q60154794 description "wetenschappelijk artikel" @default.
- Q60154794 description "наукова стаття, опублікована у вересні 2005" @default.
- Q60154794 name "Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects" @default.
- Q60154794 name "Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects" @default.
- Q60154794 type Item @default.
- Q60154794 label "Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects" @default.
- Q60154794 label "Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects" @default.
- Q60154794 prefLabel "Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects" @default.
- Q60154794 prefLabel "Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects" @default.
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- Q60154794 P1476 Q60154794-36C87AA9-9EA0-4C39-9B74-8B09FC054C4B @default.
- Q60154794 P2093 Q60154794-8DD5BC7A-7E89-4196-80FC-19C21886E5D1 @default.
- Q60154794 P304 Q60154794-090B2405-49D9-409D-BF9D-1EBA88BD93B4 @default.
- Q60154794 P31 Q60154794-0A13ADC5-AF88-402C-90FE-816A2DA4C75F @default.
- Q60154794 P356 Q60154794-49EB6BCA-A327-4B31-9C28-A655A43CD1D0 @default.
- Q60154794 P433 Q60154794-A4EFFFF5-E19D-469C-8431-F72F289CA10E @default.
- Q60154794 P478 Q60154794-3E1BCC3E-2C2D-4CC9-83F0-AE2051854A57 @default.
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- Q60154794 P921 Q60154794-7601BE8C-D61F-4BB2-A921-3C4B52068A92 @default.
- Q60154794 P356 TCAD.2005.852061 @default.
- Q60154794 P8978 Sukharev05 @default.
- Q60154794 P1104 "+10" @default.
- Q60154794 P1433 Q5970503 @default.
- Q60154794 P1476 "Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects" @default.
- Q60154794 P2093 "V. Sukharev" @default.
- Q60154794 P304 "1326-1335" @default.
- Q60154794 P31 Q13442814 @default.
- Q60154794 P356 "10.1109/TCAD.2005.852061" @default.
- Q60154794 P433 "9" @default.
- Q60154794 P478 "24" @default.
- Q60154794 P577 "2005-09-01T00:00:00Z" @default.
- Q60154794 P8978 "journals/tcad/Sukharev05" @default.
- Q60154794 P921 Q1319010 @default.