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- Q62599878 description "article scientifique publié en 2014" @default.
- Q62599878 description "wetenschappelijk artikel" @default.
- Q62599878 description "наукова стаття, опублікована в червні 2014" @default.
- Q62599878 name "Electromigration reliability of solder bumps" @default.
- Q62599878 name "Electromigration reliability of solder bumps" @default.
- Q62599878 type Item @default.
- Q62599878 label "Electromigration reliability of solder bumps" @default.
- Q62599878 label "Electromigration reliability of solder bumps" @default.
- Q62599878 prefLabel "Electromigration reliability of solder bumps" @default.
- Q62599878 prefLabel "Electromigration reliability of solder bumps" @default.
- Q62599878 P1476 Q62599878-415DC24A-B843-4EA7-85E8-68633433628F @default.
- Q62599878 P2093 Q62599878-5FCC6D26-761F-4927-9355-ED2F1432743E @default.
- Q62599878 P2093 Q62599878-E8C22070-6648-4933-8517-F63BB4DFD86C @default.
- Q62599878 P31 Q62599878-E0C41541-7872-4F01-99C6-6F9C19E436FD @default.
- Q62599878 P356 Q62599878-24192A27-1172-436A-B2D6-16572E51F435 @default.
- Q62599878 P577 Q62599878-D2B1ADDE-6F08-40B0-AA37-0C03AB541804 @default.
- Q62599878 P356 IPFA.2014.6898145 @default.
- Q62599878 P1476 "Electromigration reliability of solder bumps" @default.
- Q62599878 P2093 "Hajdin Ceric" @default.
- Q62599878 P2093 "Siegfried Selberherr" @default.
- Q62599878 P31 Q13442814 @default.
- Q62599878 P356 "10.1109/IPFA.2014.6898145" @default.
- Q62599878 P577 "2014-06-01T00:00:00Z" @default.