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- Q62743443 description "article scientifique publié en 2004" @default.
- Q62743443 description "im Dezember 2004 veröffentlichter wissenschaftlicher Artikel" @default.
- Q62743443 description "wetenschappelijk artikel" @default.
- Q62743443 description "наукова стаття, опублікована в грудні 2004" @default.
- Q62743443 name "Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology" @default.
- Q62743443 name "Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology" @default.
- Q62743443 type Item @default.
- Q62743443 label "Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology" @default.
- Q62743443 label "Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology" @default.
- Q62743443 prefLabel "Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology" @default.
- Q62743443 prefLabel "Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology" @default.
- Q62743443 P1433 Q62743443-B984A600-D5E4-4856-9E0F-8FB30E4C264D @default.
- Q62743443 P1476 Q62743443-4F49806A-6FBA-4BCD-B89E-E62DBB886CF9 @default.
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- Q62743443 P304 Q62743443-E4A6DAF5-853B-456C-A850-A6C98D728503 @default.
- Q62743443 P31 Q62743443-E25AB92B-6CD0-489E-A10D-97A22B2A638E @default.
- Q62743443 P356 Q62743443-E5039B89-1678-48C8-8522-DE1AC5B160B2 @default.
- Q62743443 P433 Q62743443-C2845557-AFC6-4863-9CE5-C72FA2317A3F @default.
- Q62743443 P478 Q62743443-0F6E7F95-4466-478B-8EBA-87F23AB0BBF5 @default.
- Q62743443 P577 Q62743443-2579912E-0A3C-4566-8B74-06AE64F2FA00 @default.
- Q62743443 P921 Q62743443-CD6A2C63-E72B-48D4-815F-8466F05380D4 @default.
- Q62743443 P356 1.1811780 @default.
- Q62743443 P1433 Q1987941 @default.
- Q62743443 P1476 "Geometric linewidth and the impact of thermal processing on the stress regimes induced by electroless copper metallization for Si integrated circuit interconnect technology" @default.
- Q62743443 P2093 "A. N. Danilewsky" @default.
- Q62743443 P2093 "B. H. W. Toh" @default.
- Q62743443 P2093 "D. W. McNeill" @default.
- Q62743443 P2093 "J. Kanatharana" @default.
- Q62743443 P2093 "J. Riikonen" @default.
- Q62743443 P2093 "J. Toivonen" @default.
- Q62743443 P2093 "L. Knuuttila" @default.
- Q62743443 P2093 "P. J. McNally" @default.
- Q62743443 P2093 "R. Simon" @default.
- Q62743443 P2093 "T. Tuomi" @default.
- Q62743443 P304 "7596-7602" @default.
- Q62743443 P31 Q13442814 @default.
- Q62743443 P356 "10.1063/1.1811780" @default.
- Q62743443 P433 "12" @default.
- Q62743443 P478 "96" @default.
- Q62743443 P577 "2004-12-15T00:00:00Z" @default.
- Q62743443 P921 Q80831 @default.