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• W109368281 abstract "Publisher Summary This chapter discusses the electric properties of thin conducting films. Thin film interconnections are an integral part of integrated circuits (ICs). They are the means by which active regions in a device communicate among themselves, and single devices communicate with each other and with the outside world. Owing to these varied tasks it is possible, indeed advisable, to have more than one level of interconnection networks employed in a given IC. A multilevel interconnect system is recommended for achieving higher speed and greater density, for minimizing the effects of certain parasitic phenomena, and for increasing the process reliability. The reliability of thin film interconnects, in particular, impacts critically on the successful implementation of all circuit types. A yield issue in current very-large-scale integration technologies, it turns out that in multilevel metallization schemes the reliability is improved. This is because of the relaxation of certain stringent requirements regarding the geometrical features and the metallurgical properties of the thin metal interconnect system. The basic electrical property of an interconnect line is its conductivity." @default.
• W109368281 created "2016-06-24" @default.
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• W109368281 date "1987-01-01" @default.
• W109368281 modified "2023-09-27" @default.
• W109368281 title "Electrical Properties of Thin Conducting Films" @default.
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• W109368281 doi "https://doi.org/10.1016/b978-0-12-234115-1.50005-2" @default.
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