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- W1175058553 abstract "The key to managing moisture-induced damage is the knowledge of moisture distribution within the microelectronic assemblies, which could be established through modelling. However, this is challenged by the breakdown of Fick's law across material interfaces due to the discontinuity of concentration. Two proposed properties – ‘wetness’ and ‘normalised concentration’ – have been advocated for enforcing continuity across material interfaces. This chapter establishes wetness as the fundamental property by proving the continuity of wetness using the equality principle of chemical potential. The applications of the wetness technique for modelling moisture diffusion in absorbants made of different materials and phases and under a range of environmental conditions are presented. The last section of this chapter is dedicated to advances in the modelling of vapour pressure in the delamination of a microelectronic assembly due to the rapid rises of temperature during solder reflow." @default.
- W1175058553 created "2016-06-24" @default.
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- W1175058553 date "2015-01-01" @default.
- W1175058553 modified "2023-09-22" @default.
- W1175058553 title "Advances in diffusion and vapour pressure modelling" @default.
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- W1175058553 doi "https://doi.org/10.1016/b978-1-84569-528-6.00005-8" @default.
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