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- W117788324 abstract "Thin foil electron microscopy techniques were used to characterize the dislocation behavior of Inconel X-750 tensile specimens tested at temperatures ranging from room temperature of 1500/sup 0/F (816/sup 0/C). Operative dislocation mechanisms were related to the fracture surface morphologies and the overall tensile response of this nickel-base alloy. Under room temperature and intermediate temperature conditions, a rather extensive dislocation substructure throughout the matrix was associated with the ductile response exhibited by Inconel X-750. In the higher temperature regime, approximately 1200 to 1300/sup 0/F (649 to 704/sup 0/C), all dislocation activity was channeled through narrow slip bands which subsequently initiated localized separation and a very faceted fracture surface appearance. The absence of a homogeneous dislocation substructure in this temperature regime resulted in a severe degradation in ductility levels. At the highest test temperature, 1500/sup 0/F (816/sup 0/C), a uniform dislocation network throughout the Inconel X-750 matrix coupled with intense dislocation activity adjacent to the grain boundaries resulted in a marked improvement in ductility." @default.
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- W117788324 date "1979-11-01" @default.
- W117788324 modified "2023-09-24" @default.
- W117788324 title "Room temperature and elevated temperature deformation characteristics of inconel X-750. [Room temperature to 816/sup 0/C]" @default.
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