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- W1179005087 abstract "This chapter discusses the formation of wells and how wells are formed in the wafer. Careful procedures are followed to ensure that minimum contaminants enter the fabrication area with the wafers. Sometimes these wafers are cleaned prior to use in a special wet clean tool, but often the wafers are known to be in an optimum state that is almost free of contamination so the extra step is not necessary. Thermal Oxidation of silicon is the high temperature reaction of the silicon wafer with oxygen, water vapor, and/or nitrogen oxides. This is usually the first operation to be performed on the wafers in the fabrication area. The chapter describes photolithography patterning. Photolithography is a printing process that uses photographic techniques to transfer a pattern from a photomask or reticle to a coating of photosensitive material, called photoresist, on the wafer surface. When the wafers arrive at photolithography, they enter a low pressure bake oven and are treated to a “sauna” of hot, dry nitrogen gas to drive off any moisture." @default.
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- W1179005087 date "2005-01-01" @default.
- W1179005087 modified "2023-09-27" @default.
- W1179005087 title "Forming Wells" @default.
- W1179005087 doi "https://doi.org/10.1016/b978-075067760-8/50006-3" @default.
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