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- W123731468 abstract "Publisher SummaryThis chapter presents the contacts and interconnections on semiconductors. In the manufacture of an integrated circuit, many devices that are electrically isolated from one another are formed into the semiconductor. These devices then require electrical interconnections to complete the integrated circuit. With the extremely demanding constraints expected to be placed upon the technology of integrated circuit fabrication in the future, in which device geometries will be dramatically reduced to achieve larger packaging densities and larger scales of integration, multilayers of closely packaged, fine-dimension interconnections among devices will be necessary. These interconnections are placed across the surface of the semiconductor and are most often insulated from the underlying substrate and from one another by a dielectric. The many requirements of the interconnection materials on semiconductors used in integrated circuits are often conflicting, and in most cases they are technologically very demanding. For example, they must be multilevel compatible and must display excellent adhesion to underlying and overlaying dielectrics." @default.
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- W123731468 date "1984-01-01" @default.
- W123731468 modified "2023-09-23" @default.
- W123731468 title "Contacts and Interconnections on Semiconductors" @default.
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- W123731468 doi "https://doi.org/10.1016/b978-0-12-756980-2.50015-1" @default.
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