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- W137723929 abstract "An evaluation was made of the relative thermal fatigue resistance of 29 solder alloys. A number of these alloys were found to be less susceptible to thermal fatigue cracking in encapsulated printed wiring board applications than the commonly used tin-lead eutectic (63Sn-37Pb). Three alloys, 95Sn-5Ag, 96.5Sn-3.5Ag, and 95Sn-5Sb offered the greatest resistance to thermal fatigue. The selection of the encapsulation materials was confirmed to be a significant factor in thermal fatigue of solder joints, regardless of the solder alloy used." @default.
- W137723929 created "2016-06-24" @default.
- W137723929 creator A5061300863 @default.
- W137723929 date "1980-02-01" @default.
- W137723929 modified "2023-09-27" @default.
- W137723929 title "Thermal fatigue evaluation of solder alloys. Final report" @default.
- W137723929 doi "https://doi.org/10.2172/5563721" @default.
- W137723929 hasPublicationYear "1980" @default.
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