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- W1420191929 abstract "During my thesis, we studied approaches to achieve light-emitting devices based on tensile strained and highly n-doped Ge epitaxial films. In order to create an elastic tensile strain in the epitaxial Ge films, we have investigated two methods: The epitaxial growth of Ge on InGaAs buffer layers that have a larger lattice constant, and the epitaxial growth of Ge on Si, by which we take benefit of the thermal expansion coefficient of Ge which is twice greater than that of Si. Concerning the growth of Ge on Si substrates, we have studied two crystalline orientations, and , in order to compare the values of the accumulated tensile strain and also the density of threading dislocations. The n-type doping in Ge was performed using a co-doping technique with phosphorus (P2 molecule) and antimony (Sb). We demonstrated that the dopants sticking coefficient leads to dopant incorporation in the Ge film larger than their solid solubility, which generally increases with increasing substrate temperature. As a result, when the doping is carried out at relatively low temperatures and followed by rapid thermal annealing, electrically activated electron concentration of 4x1019 cm-3 was demonstrated. This value is one of the best results obtained experimentally so far. The radiative recombination, at RT, measured by photoluminescence spectroscopy showed an increase in the direct gap emission of Ge of about 150 times. Finally, we studied the effects of diffusion barrier on the doping concentration during the thermal annealing. A comparison between the advantages of three diffusion barriers, Al2O3, HfO2 and Si3N4, will be presented and discussed." @default.
- W1420191929 created "2016-06-24" @default.
- W1420191929 creator A5018418033 @default.
- W1420191929 date "2015-09-18" @default.
- W1420191929 modified "2023-09-23" @default.
- W1420191929 title "Tensile-strained and highly n-doped Germanium for optoelectronic applications" @default.
- W1420191929 hasPublicationYear "2015" @default.
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