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- W1432510177 abstract "Experiments were performed to correlate mechanical damage in silicon single crystal wafers with oxidationinduced stacking fault nucleation. Evidence was obtained which supported a dislocation-interaction-dissociation model. Dislocations were introduced into test wafers by plastic deformation at room temperature through cohtrolledload scratching and static indentation. Subsequently the test wafers were either oxidized or annealed in nitrogen at 1150°C, and etched to delineate stacking fault formation. It is proposed that glissile, (110) dislocations on inter secting {111} slip planes, generated in the strain field resulting from the deformation tool, interact forming Lomer lock sessile dislocations. Subsequent oxidation promotes dissociation of the lock into a Shockley partial dislocation, ^ (112), which glides out of the wafer surface and a Frank partial dislocation, ^ (111), which becomes a stacking fault nucleus." @default.
- W1432510177 created "2016-06-24" @default.
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- W1432510177 date "1978-01-01" @default.
- W1432510177 modified "2023-09-28" @default.
- W1432510177 title "Plastic deformation in silicon at room temperature as a mode for stacking fault formation" @default.
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- W1432510177 hasPublicationYear "1978" @default.
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