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• W1465004816 abstract "Publisher Summary This chapter deals with thin films that are utilized in microelectronic devices. Computers and other related devices depend on metallic or semiconducting layers, which have a thickness that is one-tenth that of a human hair. As electronic devices shrink, these layers represent a greater fraction of the total device volume. These films determine the electrical characteristics and also the stability (reliability) of the devices. The thin films used in microelectronics are extremely vulnerable to a multitude of external influences. Among them are (1) environmental interactions (corrosion), (2) interdiffusion of the individual components at elevated temperatures, (3) thermal grooving (caused by an imbalance of surface tension, which occurs when grain boundaries meet external surfaces), (4) thermotransport (caused by a temperature gradient–induced mass transport), (5) electrotransport (migration of metal ions under the influence of an electric field), (6) short circuits (because of extrusions), and (7) mechanical problems. All these factors shorten the lifetime of microelectronic devices, which, when a failure occurs, may endanger human life (such as in airplanes or space applications) or result in substantial property loss." @default.
• W1465004816 created "2016-06-24" @default.
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• W1465004816 date "1987-01-01" @default.
• W1465004816 modified "2023-09-27" @default.
• W1465004816 title "Chapter 3: Application and Deterioration of Thin Films Used for Microelectronic Devices" @default.
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• W1465004816 doi "https://doi.org/10.1016/s0167-2991(09)60452-3" @default.
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