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• W146682325 abstract "A portable computer that can be worn on the body produces unique design constraints. The wearable computer must be rugged, lightweight, small, and power-efficient. The most recently-developed wearable computer is the Navigator2 which will be used as a computerized maintenance manual with the capacity of speech recognition. Its thermal management develops concurrently with the overall design of the Navigator2. The first stage of the thermal design is to select the type of cooling arrangement that is needed. With a completely closed housing and an anticipated power level of approximately 10W, it is decided early in the thermal management to use conduction to transfer the heat to the outer casing where it is then dissipated through natural convection. In the second stage of the thermal design, the thermal contact between the aluminum heat spreader (used to conduct heat to the outer casing) and the electronics is optimized. The liquid heat sink (LHS) by 3M, Inc. and the Gap Pad by the Bergquist Company are two thermal interfaces that were tested. The LHS is a plastic pouch filled with fluorinert liquid that produces an isothermal platform. On the other hand, the Gap Pad is a conductive elastomer. In experiments conducted on these devices, the Gap Pad consistently yielded a smaller temperature rise from the electronics to the surrounding air and is chosen as the thermal interface. The third stage consists of numerical simulations modelling the conduction of heat of the Navigator2 using natural convection as the boundary conditions. This conduction-only model approximates the temperatures that are expected in the Navigator2 before it is manufactured and predicts that an area of 150 ambient air to adequately cool the electronics. 2 in of aluminum needs to be exposed to the Another aspect of the thermal design of wearable computers is that of embedded electronics. Because a portable computer worn on the body imposes unique design constraints, it has been postulated that embedding the electronics in a plastic substrate could aid the conduction heat transfer. By depositing the plastic material over the electronics, all air gaps are practically eliminated, leaving a nearly perfect avenue for the heat to transfer into the substrate. Thus, the plastic aids the heat spreader in removing the heat, making it easier to minimize the maximum temperature within the wearable computer—the goal of the thermal design. Three main parameters are involved in the thermal design of embedded electronics: the heat spreader, air channels, and substrate material. The heat spreader consists of an aluminum plate which has good thermal contact with the heat-producing elements. The heat spreader then extends out of the substrate into the ambient air where heat is removed by natural convection. Air channels through the substrate aid the process of natural convection by exposing more of the heat spreader to the ambient air. Various polymer composites were investigated to determine the effect of the conductivity of the polymer composite upon the overall heat transfer. The conductivity of the polymer composite can be changed by varying the amount, type, grain size, and orientation of the conductive filler that is blended with the epoxy." @default.
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• W146682325 date "1995-01-01" @default.
• W146682325 modified "2023-09-27" @default.
• W146682325 title "Thermal design of wearable computers : application to the Navigator 2, thermal management devices, and embedded electronics" @default.
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