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• W1468726021 abstract "The effects of Zn addition on microstructure development and tensile properties of Sn–2.0Ag–0.7Cu (SAC207) lead-free solders were investigated. Microstructural analysis reveal that 1.5 wt.% Zn addition not only refined the Ag3Sn and Cu6Sn5 particles, but also increased the eutectic area and promoted the formation of small γ-(Cu, Ag)5Zn8 intermetallic compound (IMC), which in turn increased the yield strength (YS), ultimate tensile strength (UTS) and Young's modulus, but the ductility decreased. With increasing Zn content up to 3.0 wt.%, the reaction phase grain, γ-(Cu, Ag)5Zn8, becomes larger and its morphology changes from a strip-like shape into flower-like or dendritic shape. Moreover, the Ag3Sn and Cu6Sn5 particles are significantly diminished. The observed decrease of Ag3Sn and Cu6Sn5 particles appears to cause a slight increase in Young's modulus, YS and UTS of Zn modified solder. Detailed mechanisms of Ag3Sn and Cu6Sn5 suppression and γ-(Cu,Ag)5Zn8 formation were discussed and proposed." @default.
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• W1468726021 date "2015-12-01" @default.
• W1468726021 modified "2023-10-02" @default.
• W1468726021 title "Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying" @default.
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• W1468726021 doi "https://doi.org/10.1016/j.jallcom.2015.09.033" @default.
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