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- W147222254 abstract "The discharge time lag due to deteriorations of high humidity and rough dielectric surface in insulation-gap-metal system has been studied using CIGRE Method II (CM II) electrode. The sample was polymethylmethacrylate (PMMA). The residual probability of time lag was becoming shorter as the relative humidity (RH) rises. It is considered due to the electrons detached from water molecule. The characteristics time lag at 36.8 % of residual probability made the positive polarity shorter than the negative. Time lag with positive polarity was more sensitive to the applied voltage than the negative one. A rough surface brought by plasma exposure would enhance electrical field so that the discharge would be easier to take place with shorter time lag. Decrease in discharge time lag would make possible for partial discharge (PD) occurred with large number of small discharges. After 20 and 60 minutes of recovery times, the time lag of 16 and 21 seconds of exposure levels were not change significantly. However, at 3 seconds of exposure level, 60 minutes of recovery time was long enough to shift the curve to the longer time lag compares to that of 20 minutes. It seems that the treatment changes the surface properties of material only, not the bulk properties. Index Terms—CM II, cumulative and residual probabilities, partial discharge, plasma, PMMA, relative humidity" @default.
- W147222254 created "2016-06-24" @default.
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- W147222254 date "2010-11-07" @default.
- W147222254 modified "2023-09-22" @default.
- W147222254 title "An Experiment on Discharge Time Lag Affected by Humidity and Rough Surface in a PMMA Closed Void" @default.
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