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• W1481246450 abstract "For the first time we demonstrate that a Phase Change Memory (PCM) packaged chip can hold pre-coded data after an industrial standard lead free solder bonding reflow process. Good “0” and “1” state distributions are retained in a 90nm 128Mb PCM chip after the soldering process. Furthermore, the tested chip endures more than 10 million write cycles after the pre-coding and high temperature process." @default.
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• W1481246450 date "2011-06-14" @default.
• W1481246450 modified "2023-09-27" @default.
• W1481246450 title "A method to maintain phase-change memory pre-coding data retention after high temperature solder bonding process in embedded systems" @default.
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