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- W1484617054 abstract "A full-wave electromagnetic solver has been used to investigate the effects of technology migration on signal integrity for a single on-chip interconnects. In addition, the effects of using new interconnect materials and/or low-/spl kappa/ dielectrics have also been investigated. The EM solver has been used to calculate the electromagnetic quantities S parameters for the single on-chip interconnect, which are then transformed to an RLCG transmission-line equivalent circuit model. Consequently, a SPICE-like simulator is used to evaluate the signal integrity parameters." @default.
- W1484617054 created "2016-06-24" @default.
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- W1484617054 date "2003-10-01" @default.
- W1484617054 modified "2023-09-24" @default.
- W1484617054 title "Technology migration effects on signal integrity of single on-chip interconnect" @default.
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- W1484617054 doi "https://doi.org/10.1109/mwscas.2002.1186994" @default.
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