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• W1485117035 abstract "Threshold voltage instability is a critical problem for high-K dielectric implementation. This problem is much more serious for short channel devices due to process induced gate edge damage. A novel stress relieved pre-oxide (SRPO) followed by ALD of HfO/sub 2/ reduces the local charge density near the gate edge and short channel threshold voltage instability. Excellent cross wafer CETinv uniformity is achieved for the SRPO process. A new tantalum carbon alloy metal gate achieves a lower Vtsat than TaSiN gated devices due to a lower work function. Compared to HfO/sub 2//TaSiN devices using standard RCA pre-clean, HfO/sub 2//tantalum carbon alloy metal gate stack using the novel SRPO demonstrates a 3/spl times/ smaller Vt shift for short channel devices and a 16% Ion/Ioff improvement." @default.
• W1485117035 created "2016-06-24" @default.
• W1485117035 creator A5010869946 @default.
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• W1485117035 date "2005-04-19" @default.
• W1485117035 modified "2023-10-18" @default.
• W1485117035 title "Improved short channel device characteristics with stress relieved pre-oxide (SRPO) and a novel tantalum carbon alloy metal gate/HfO/sub 2/ stack" @default.
• W1485117035 doi "https://doi.org/10.1109/iedm.2004.1419303" @default.
• W1485117035 hasPublicationYear "2005" @default.
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