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• W1486670606 abstract "We connected two III–V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission." @default.
• W1486670606 created "2016-06-24" @default.
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• W1486670606 date "2015-04-01" @default.
• W1486670606 modified "2023-10-18" @default.
• W1486670606 title "Optical interconnection between III&#x2013;V chips on Si by using photonic wire bonding" @default.
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• W1486670606 doi "https://doi.org/10.1109/oic.2015.7115715" @default.
• W1486670606 hasPublicationYear "2015" @default.
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