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Matches in SemOpenAlex for { <https://semopenalex.org/work/W1487971559> ?p ?o ?g. }

• W1487971559 abstract "In the trend of miniaturization, low cost, and high performance of electronic packages, high density flip chip interconnect has been required to interface with very fine pitch chips like signal processors and multiple thin dies package, this raise a great challenge to related interconnect technology in electronic packaging for high density, small feature size, and high performance." @default.
• W1487971559 created "2016-06-24" @default.
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• W1487971559 date "2015-08-01" @default.
• W1487971559 modified "2023-09-22" @default.
• W1487971559 title "Study of fine pitch copper pillar solder joint on HDI flexible substrate for wearable devices" @default.
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• W1487971559 doi "https://doi.org/10.1109/icept.2015.7236820" @default.
• W1487971559 hasPublicationYear "2015" @default.
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