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- W1492030782 abstract "As society goes to mobile, data bandwidth is required to increase every year. Memory industry community is responsible for products like DDR3, DD4 and for mobile LPDDR3 and LPDDR4, etc. However, the products launching speed do not match well with the industry requirements. Hence revolutionary specs, such as HBM, HMC, and wide I/O 1 and wide I/O 2 have been proposed. However, to realize these memory products, TSV is needed. Even though samples have been delivered but the high price of TSV prevent wide spread use of these innovative memory products." @default.
- W1492030782 created "2016-06-24" @default.
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- W1492030782 date "2015-05-01" @default.
- W1492030782 modified "2023-09-22" @default.
- W1492030782 title "A TSV-less PoP packaging structure for high bandwidth memory" @default.
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- W1492030782 doi "https://doi.org/10.1109/ectc.2015.7159698" @default.
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