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- W1498167855 abstract "The authors have developed 4-in and 6.5-in diagonal a-Si thin-film-transistor, active-matrix, liquid-crystal-display (TFT-LCD) modules using tape automated bonding (TAB) technology. The small frame size, 12.5 mm for 4-in modules, has been realized by using U-shape bending tape carriers. In the inner-lead-bonding process, the Au bumps on a driver LSI are connected to the Cu/Sn inner leads on a tape carrier by a high-speed, fully automated gang bonding technique. The LSIs are encapsulated with halogen-ion-free epoxy resin. In the outer-lead-bonding (OLB) process, the Al electrodes on an LC panel are connected to the outer leads on a tape carrier through an anisotropic conductive film (ACF) by a thermocompression apparatus. The ACF, which consists of thermosetting resin and dispersed Ni particles, realizes highly reliable OLB. The TFT-LCD module reliability was confirmed by various environmental and mechanical tests.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
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- W1498167855 date "2003-01-13" @default.
- W1498167855 modified "2023-09-26" @default.
- W1498167855 title "Development of TFT-LCD TAB modules" @default.
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- W1498167855 doi "https://doi.org/10.1109/iemts.1989.76114" @default.
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