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• W1498626130 abstract "Semiconductor product design content changes in recent technology nodes significantly changes yield even when the same die size is maintained. A method and software has been developed and implemented in IBM's 32 and 14nm ASIC products to track yield impacts related to content change throughout the design process so that unexpected cost impacts can be avoided." @default.
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• W1498626130 date "2015-05-01" @default.
• W1498626130 modified "2023-09-26" @default.
• W1498626130 title "Composite attribute method and software to interlock semiconductor product design and manufacturing yield" @default.
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• W1498626130 doi "https://doi.org/10.1109/asmc.2015.7164432" @default.
• W1498626130 hasPublicationYear "2015" @default.
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