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- W1501808370 abstract "In the process of HGA fabrication, a shunting process is performed in order to prevent the ESD effect but when an HGA is required for another process the shunt tab has to be trimmed. This process is thought to cause the damage of GMR heads at the Al2O3 gap between the shunt tab and the substrate. The simulated and measured results are compared to investigate this possibility." @default.
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- W1501808370 date "2001-09-01" @default.
- W1501808370 modified "2023-09-27" @default.
- W1501808370 title "Voltage raised in Al 2 O 3 gap of GMR head in the deshunting process" @default.
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