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- W1502724967 abstract "Failure mechanisms exposed by environmental accelerating testing methods such as thermal cycling or thermal shock test, may differ from those at the service operating conditions. While the device is heated up or cooled down evenly on its external surface during environmental testing, real operating powered devices experience temperature gradients caused by internal local heating, components' different heat dissipation capability, and ambient temperature variation, etc. In this study, a power cycling technique is introduced to better approximate the field operating conditions by activating field failure modes. Power cycling test is performed with different solder joints, that is, lead contained and lead free, and the result is compared with environmental test results. Real time moire interferometry is applied to measure the global/local thermomechanical behavior of different solder joints during power cycling excursion and compared with thermal cycling case. Effective damage parameter is extracted from the experiment and applied to account for the thermal fatigue life difference for different solder joint composition and accelerating testing conditions. In addition, a physical mechanism, which may happen in power cycling condition only, is proposed in order to account for the abnormal fatigue life behavior of two solders. Low thermal conductivity and high specific heat of SAC result in higher temperature difference between upper and lower substrate which induce high shear strain due to CTE mismatch. This mechanism should be considered to evaluate thermomechanical reliability of 2 nd level solder joints." @default.
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- W1502724967 date "2004-08-01" @default.
- W1502724967 modified "2023-09-28" @default.
- W1502724967 title "Effect of Thermal Conductivity on its Thermal Fatigue Behavior of Solder Joints under Power Cycling Condition" @default.
- W1502724967 hasPublicationYear "2004" @default.
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