Matches in SemOpenAlex for { <https://semopenalex.org/work/W1503363485> ?p ?o ?g. }
Showing items 1 to 72 of
72
with 100 items per page.
- W1503363485 abstract "3D integration technology using through silicon via (TSV) is progressing for high volume manufacturing in various applications. Thin wafer handling using temporary bonding technology is an important process within 3D integration. There are several temporary de-bonding processes being developed and used in industry, such as thermal slide debonding, mechanical de-bonding and laser de-bonding. In general, thermal slide de-bonding materials, which consist of thermoplastic polymer, are considered to be the most suitable for high throughput and easy de-bonding. However, they also have the disadvantage of thermal resistance during 3D-IC processes such as PECVD process. In order to improve the thermal resistance, higher Tg materials should be considered but, high Tg materials often introduce additional wafer stress, and increase the difficulty of bonding and de-bonding. A new temporary bonding material has been developed for thermal slide de-bonding which provides high thermal resistance, low residual stress, easy bonding and de-bonding, good chemical resistance and easy cleaning after the de-bonding process. This paper will discuss a DOE conducted for adjusting rheological properties and the data showed that viscosity was drastically decreased and remain suitable for the bonding and de-bonding processes. The newly developed material is expected to contribute to future high performance in 3D-IC processes." @default.
- W1503363485 created "2016-06-24" @default.
- W1503363485 creator A5009231708 @default.
- W1503363485 creator A5076517299 @default.
- W1503363485 creator A5088008947 @default.
- W1503363485 creator A5091132761 @default.
- W1503363485 creator A5074512370 @default.
- W1503363485 date "2015-05-01" @default.
- W1503363485 modified "2023-10-18" @default.
- W1503363485 title "Material development for 3D wafer bond and de-bonding process" @default.
- W1503363485 cites W2011983487 @default.
- W1503363485 cites W2034503231 @default.
- W1503363485 cites W2053127641 @default.
- W1503363485 cites W2056742408 @default.
- W1503363485 cites W2137349419 @default.
- W1503363485 doi "https://doi.org/10.1109/ectc.2015.7159700" @default.
- W1503363485 hasPublicationYear "2015" @default.
- W1503363485 type Work @default.
- W1503363485 sameAs 1503363485 @default.
- W1503363485 citedByCount "3" @default.
- W1503363485 countsByYear W15033634852020 @default.
- W1503363485 countsByYear W15033634852021 @default.
- W1503363485 countsByYear W15033634852023 @default.
- W1503363485 crossrefType "proceedings-article" @default.
- W1503363485 hasAuthorship W1503363485A5009231708 @default.
- W1503363485 hasAuthorship W1503363485A5074512370 @default.
- W1503363485 hasAuthorship W1503363485A5076517299 @default.
- W1503363485 hasAuthorship W1503363485A5088008947 @default.
- W1503363485 hasAuthorship W1503363485A5091132761 @default.
- W1503363485 hasConcept C10138342 @default.
- W1503363485 hasConcept C111919701 @default.
- W1503363485 hasConcept C127413603 @default.
- W1503363485 hasConcept C144133560 @default.
- W1503363485 hasConcept C160671074 @default.
- W1503363485 hasConcept C192562407 @default.
- W1503363485 hasConcept C201414436 @default.
- W1503363485 hasConcept C2779133538 @default.
- W1503363485 hasConcept C41008148 @default.
- W1503363485 hasConcept C49040817 @default.
- W1503363485 hasConcept C61696701 @default.
- W1503363485 hasConcept C69738904 @default.
- W1503363485 hasConcept C98045186 @default.
- W1503363485 hasConceptScore W1503363485C10138342 @default.
- W1503363485 hasConceptScore W1503363485C111919701 @default.
- W1503363485 hasConceptScore W1503363485C127413603 @default.
- W1503363485 hasConceptScore W1503363485C144133560 @default.
- W1503363485 hasConceptScore W1503363485C160671074 @default.
- W1503363485 hasConceptScore W1503363485C192562407 @default.
- W1503363485 hasConceptScore W1503363485C201414436 @default.
- W1503363485 hasConceptScore W1503363485C2779133538 @default.
- W1503363485 hasConceptScore W1503363485C41008148 @default.
- W1503363485 hasConceptScore W1503363485C49040817 @default.
- W1503363485 hasConceptScore W1503363485C61696701 @default.
- W1503363485 hasConceptScore W1503363485C69738904 @default.
- W1503363485 hasConceptScore W1503363485C98045186 @default.
- W1503363485 hasLocation W15033634851 @default.
- W1503363485 hasOpenAccess W1503363485 @default.
- W1503363485 hasPrimaryLocation W15033634851 @default.
- W1503363485 hasRelatedWork W1921331855 @default.
- W1503363485 hasRelatedWork W1964263546 @default.
- W1503363485 hasRelatedWork W1976401081 @default.
- W1503363485 hasRelatedWork W1986456852 @default.
- W1503363485 hasRelatedWork W2033414592 @default.
- W1503363485 hasRelatedWork W2048392237 @default.
- W1503363485 hasRelatedWork W2147755521 @default.
- W1503363485 hasRelatedWork W2151837802 @default.
- W1503363485 hasRelatedWork W2532494584 @default.
- W1503363485 hasRelatedWork W4284691113 @default.
- W1503363485 isParatext "false" @default.
- W1503363485 isRetracted "false" @default.
- W1503363485 magId "1503363485" @default.
- W1503363485 workType "article" @default.