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• W1507582981 abstract "The design and technology of hybrid electronic ceramic circuits with flip-chip and SMD (Surface Mounting Device) components are presented in the paper. The flipchip audio amplifier and RF (Radio Frequency) transmitting and receiving modules are fabricated using LTCC (Low Temperature Co-fired Ceramics). X-Ray inspection is performed to analyze the solder bonding quality. The application of special underfill has increased the reliability of interconnections between flip-chip, SMD components and the ceramic multilayer substrate. The final structure of the audio amplifier module is encapsulated with ceramic housing." @default.
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• W1507582981 date "2011-01-01" @default.
• W1507582981 modified "2023-09-27" @default.
• W1507582981 title "Design and technology of hybrid multilayer electronic circuits" @default.
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