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• W1513348524 abstract "The growth behavior of intermetallic layer with or without adding 0.3 wt% Ni into the Sn–0.7Cu solder was studied during the wetting reaction on Cu-substrate and thereafter in solid-state aging condition. The Cu-solder reaction couple was prepared at 255, 275 and 295 °C for 10 s. The samples reacted at 255 °C were then isothermally aged for 2–14 days at 150 °C. The reaction species formed for the Sn–0.7Cu/Cu and Sn–0.7Cu–0.3Ni/Cu soldering systems were Cu6Sn5 and (CuNi)6Sn5, respectively. The thickness of the intermetallic compounds formed at the solder/Cu interfaces and also in the bulk of both solders increased with the increase of reaction temperature. It was found that Ni-containing Sn–0.7Cu solder exhibited lower growth of intermetallic layer during wetting and in the early stage of aging and eventually exceeded the intermetallic layer thickness of Sn–0.7Cu/Cu soldering system after 6 days of aging. As the aging time proceeds, a non-uniform intermetallic layer growth tendency was observed for the case of Sn–0.7Cu–0.3Ni solder. The growth behavior of intermetallic layer during aging for both solders followed the diffusion-controlled mechanism. The intermetallic layer growth rate constants for Sn–0.7Cu and Sn–0.7Cu–0.3Ni solders were calculated as 1.41 × 10−17 and 1.89 × 10−17 m2/s, respectively which indicated that adding 0.3 wt% Ni with Sn–0.7Cu solder contributed to the higher growth of intermetallic layer during aging." @default.
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• W1513348524 date "2007-07-01" @default.
• W1513348524 modified "2023-10-07" @default.
• W1513348524 title "Effect of adding 0.3wt% Ni into the Sn–0.7wt% Cu solder" @default.
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• W1513348524 doi "https://doi.org/10.1016/j.jallcom.2006.08.071" @default.
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