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- W1519571877 endingPage "367" @default.
- W1519571877 startingPage "339" @default.
- W1519571877 abstract "Integration of porous dielectric materials into microelectronic devices has become crucial for next-generation integrated circuit interconnect technology. However, due to their inherent mechanical weakness, reliability of copper/low-k structures is a serious concern. Therefore, achieving sufficient mechanical properties and good adhesion of these dielectric materials to the surrounding layers becomes necessary to ensure thermomechanical integrity, especially in the case of highly porous low-k dielectrics. In this chapter, the mechanical and fracture properties of low-k materials are discussed in detail, with a focus on hybrid low-k dielectrics. For each of these properties, an overview of the most commonly used measurement techniques is given, followed by several case studies. These case studies include the impact of film porosity, organic porogen content, UV radiation, organic cross-linking and/or terminal groups on the mechanical properties of organosilicate glasses. Furthermore, the effect of porosity, network structure, UV radiation and reactive species in the environment on the fracture behavior of organosilicate glass films is discussed in detail." @default.
- W1519571877 created "2016-06-24" @default.
- W1519571877 creator A5007802191 @default.
- W1519571877 creator A5033660264 @default.
- W1519571877 creator A5084846204 @default.
- W1519571877 date "2012-02-17" @default.
- W1519571877 modified "2023-10-03" @default.
- W1519571877 title "Mechanical Reliability of Low-k Dielectrics" @default.
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