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• W1520062364 abstract "Changes in gate stacks (TaN/high-κ/SiO2/Si) are investigated during thermal processing using in situ Fourier transform infrared spectroscopy. Ta–O bonds, present in the initial tantalum nitride films, are crystallized in contact with HfO2 at 700–800 °C and completely dissociate at 900 °C, resulting in a microcrystalline TaNx phase. The TaN remains amorphous, however, with Al2O3 as the underlying dielectric layer. A partial reduction into a metallic Ta occurs after dissociation of Ta–N and Ta–O bonds, and Al2O3 decomposes at 700 °C. Dissociated Al atoms diffuse into all the neighboring layers to form silicate and Ta- and N-bound Al." @default.
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• W1520062364 date "2010-04-12" @default.
• W1520062364 modified "2023-10-14" @default.
• W1520062364 title "Thermal stability comparison of TaN on HfO2 and Al2O3" @default.
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• W1520062364 doi "https://doi.org/10.1063/1.3396189" @default.
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