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- W1520192557 abstract "Polishing in microfabrication is a decendant of glass polishing which is an established technology since 400 years. The mechanism is different from grinding, as chemical mechanical polishing (CMP) works in the atomic regime. Atomic bonds are weakened or broken, and removal is based on chemical reactions between the slurry and the surface and the mechanical effect of the abrasive particles. The CMP tool consists of a solid, extremely flat platen, on which the polishing pad is glued. There are four major elements in a CMP process: topography, materials, polishing pad and slurry. There are three modes in polishing, depending on the degree of contact between the pad and the wafer. In CMP there are two components: in addition to the mechanical pressure, chemical modifications and etching take place. CMP is a relatively young microfabrication technique, and one with very complex phenomenology. Controlled Vocabulary Terms chemical mechanical polishing; chemical reactions; etching; microfabrication; topography (Earth)" @default.
- W1520192557 created "2016-06-24" @default.
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- W1520192557 date "2010-09-17" @default.
- W1520192557 modified "2023-09-26" @default.
- W1520192557 title "CMP: Chemical-Mechanical Polishing" @default.
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- W1520192557 doi "https://doi.org/10.1002/9781119990413.ch16" @default.
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