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• W1521637460 abstract "The thermal stability of high‐k gate dielectrics and metal gate stack materials under consideration for ULSI technology must be examined for their integration into the MOSFET process flow. In this study, we evaluate the thermal stability of amorphous lanthanum aluminate (LaAlO3) thin films and metal gate — Hf based gate dielectric stacks on Si (100). XPS, XRD, AFM, TEM, wet etching and backside SIMS are utilized to evaluate the stack stability upon rigorous rapid thermal anneals (RTA) in flowing N2 ambient. Al2O3 capped LaAlO3 thin films show a crystallization dependence on the out‐diffusion of La and Al into the underlying Si substrate. Penetration of La and Al are seen above 950 °C RTA for 20 s. Evaluation of uncapped and W capped Ru on Hf‐based high‐k gate stacks indicate, Ru inter‐diffusion below the detection limits of SIMS and substantial W diffusion throughout the gate stack upon a 1000 °C, 10 s RTA in N2." @default.
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• W1521637460 date "2005-01-01" @default.
• W1521637460 modified "2023-10-12" @default.
• W1521637460 title "Thermal Stability Studies of Advanced Gate Stack Structures on Si (100)" @default.
• W1521637460 doi "https://doi.org/10.1063/1.2062955" @default.
• W1521637460 hasPublicationYear "2005" @default.
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