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- W1523123485 abstract "A highly reliable nano-clustering silica (NCS) with low dielectric constant(k<2.3) and high elastic modulus (E=10 Gpa) for copper damascene process has been developed by controlling the size and distribution of pores in the NCS precursor. Using this material in a process compatible with the 90 nm technology node, we successfully demonstrated Cu wiring in NCS dielectrics." @default.
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- W1523123485 date "2004-03-23" @default.
- W1523123485 modified "2023-09-26" @default.
- W1523123485 title "A highly reliable nano-clustering silica with low dielectric constant (k>2.3) and high elastic modulus (E=10 GPa) for copper damascene process" @default.
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- W1523123485 doi "https://doi.org/10.1109/iitc.2003.1219716" @default.
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