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- W1535215916 abstract "This chapter contains sections titled: Introduction Hierarchy of Electronic Packaging Substrates, Carriers, and Laminates Flexible Laminates First Level Packaging /Semiconductor Packaging Second Level Packaging Reliability Enhancements Thermal Management Summary Acknowledgements" @default.
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- W1535215916 date "2014-09-05" @default.
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- W1535215916 title "Role of Adhesion Phenomenon in the Reliability of Electronic Packaging" @default.
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- W1535215916 doi "https://doi.org/10.1002/9781118831373.ch6" @default.
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