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- W1535474648 abstract "High speed multi serial-link devices are rapidly applied in the field of network server and switch. To achieve high pin count (exceeding 2,000 pin) and high speed devices, we have been developing FC-BGA (Flip-chip BGA) package applied high-density organic substrate to achieve multi Gbps transmission [1]. The demand of signal speed approaches 28Gbps, and multi-lane serial links are also required. There are some reports over 28Gbps transmission by electrical signal transmission [2]. On the other hand, the DC-block (AC-coupling) technique for serdes transmission method is commonly used in the field of high speed communication. This DC-block method can cancel the offset voltage of the direct-current between input and output circuit, set the optimize voltage of the receiver circuit, control the level shift and reduce the common noise. There are many advantages by adopting DC-block functions." @default.
- W1535474648 created "2016-06-24" @default.
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- W1535474648 date "2015-05-01" @default.
- W1535474648 modified "2023-09-23" @default.
- W1535474648 title "Multi-28Gbps serial-link FCBGA equipped DC-block capacitors on the package" @default.
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- W1535474648 doi "https://doi.org/10.1109/ectc.2015.7159642" @default.
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