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- W15364892 abstract "Heat dissipation in a typical micromodule package is considered. A temperature history for every element in the package is obtained for various heat inputs. The approach used is to approximate the package by a network of heat storage nodes and heat conduction paths. The differential equations based on this heating system were solved using the Herman Heat Transfer Program for the CDC 1604 Digital Computer. (auth)" @default.
- W15364892 created "2016-06-24" @default.
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- W15364892 date "1962-11-01" @default.
- W15364892 modified "2023-09-26" @default.
- W15364892 title "TRANSIENT HEAT TRANSFER IN MICROMODULES" @default.
- W15364892 hasPublicationYear "1962" @default.
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